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c) Energy storage performance up to the maximum field. d) Comparison of QLD behavior MLCCs and "state-of-art" RFE and AFE type MLCCs as the numbers beside the data …
The first IMC layer grown on the Cu substrate is Cu 3 Sn layer. The formation of this IMC is usually observed during the soldering process. Typically, the thickness of Cu 3 Sn …
The Ag 3 Sn particle size inside the solder joint increases significantly after aging, as can be seen in Figure 1(b–d). This will cause a change in the direction of rotation in the high-energy release …
Thermal fatigue frequently leads to failure in electronic solder joints. Here, the authors measure and quantitatively explain how microstructure affects thermal fatigue in a ball …
The microstructure evolution and grain orientation were studied by observing the cross-section and top-view surfaces of solder joints. Findings Original Cu 3 Sn solder joint …
The solder joint size shape, with a thickness of 0.5 mm, is shown in Figure 1, and the soldering flux selected was CX600 washed soldering flux. 2.2. Experimental …
The shape simulation of solder joint is achieved by solving the differential equation of liquid solder wetting on a solid surface based on the principle of minimum energy. …
The results indicate that as the duration of the high-temperature storage increased, the grain continued to coarsen, resulting in an average pore size transition from …
Researchers conducted power cycling tests on the two solder joints and found that Sn-10Sb/Cu solder joints had higher reliability. Ni 3 Sn 4 IMC was formed in Sn-5.5Sb/Ni solder joints and Cu 6 Sn 5 IMC was formed in Sn-5.5Sn/Cu solder joints . During solidification, Ni and Cu elements diffuse into Sn-5.5Sb solder.
The grain size of thick joints is larger than that of thin joints and solder grain size increases during fatigue testing. Under identical loads, thin joints with initially smaller grain sizes are expected …
for the U.S. Department of Energy. Overview • Project start: June 2007 • Project end: September 2010 • Percent complete: 30% • Total project funding Received ... Solder Joint Chip size: 2.5 …
The experimental findings unveil that the influence of β-Sn grains on the thermomechanical properties of solder joints is particularly pronounced and size effects …
Thermal Fatigue of flip chip component solder joints is widely existing in thermal energy systems, which imposes a great challenge to operational safety. In order to investigate …
c) Energy storage performance up to the maximum field. d) Comparison of QLD behavior MLCCs and "state-of-art" RFE and AFE type MLCCs as the numbers beside the data points are the cited references. …
The grain size of thick joints is larger than that of thin joints and solder grain size increases during fatigue testing. Under identical loads, thin joints with initially smaller grain sizes are expected to have a longer fatigue life than thick joints …
Solder joints with different cross-sectional areas were designed to obtain different Joule heating properties. The effects of the interfacial intermetallic compound (IMC) and mechanical properties of Sn58Bi/Cu solder joints were studied for different Joule heating properties.
Liang et al. studied the effects of current density and Joule heat on the electromigration of SnAg solder joints. It is found that current density and Joule heat caused electromigration failure, which reduced the reliability of lead-free interconnect solder joints.
Storage time did not have a significant effect on the fracture behavior. The fracture load and energy of the solder joints decreased significantly when the temperature was …
Similarly, the growth rate of the interfacial IMC was consistent with that observed at lower temperatures. Exposure of the solder joint to different environmental conditions, such as high temperatures, would change its microstructure. There is a large literature on the effect of different thermal conditions on the microstructure of solder.
The solder joint with a typical geometry used in ball grid arrays (BGA) is illustrated in Fig. 1 and the capillary pressure is calculated with (12) P CB = F CB r s 2 π, …
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